Appicaton:
Ba-vòltaj sikwi brekè, tèmik surcharg
Karakteristik | Rezistivite (200c μω.m) | Max.working tanperati (0c) | Fòs rupture (MPa) | Pwen k ap fonn (0c) | Dansite (g/cm3) | TCR X10-6/ 0C (20 ~ 600 0C) | EMF vs Cu (μV/ 0c) (0 ~ 100 0c) |
Alyaj alyaj | |||||||
NC005 (Cuni2) | 0.05 | 200 | ≥220 | 1090 | 8.9 | <120 | -12 |
Copper nikèl alyaj- cuni2
Kontni chimik, %
Ni | Mn | Fe | Si | Cu | Lòt | ROHS Directive | |||
Cd | Pb | Hg | Cr | ||||||
2 | - | - | - | Bal | - | ND | ND | ND | ND |
Pwopriyete mekanik
Max kontinyèl sèvis temp | 200ºC |
Resisivite nan 20 ºC | 0.05 ± 10%ohm mm2/m |
Densite | 8.9 g/cm3 |
Tèmik konduktivite | <120 |
Pwen k ap fonn | 1090ºC |
Fòs rupture, N/mm2 rkwit, mou | 140 ~ 310 MPa |
Fòs rupture, N/mm2 frèt woule | 280 ~ 620 MPa |
Elongasyon (anneal) | 25%(min) |
Elongasyon (frèt woule) | 2%(min) |
EMF vs Cu, μV/ºC (0 ~ 100 ºC) | -12 |
Estrikti mikrografik | ustenit |
Pwopriyete mayetik | Non |