Byenveni nan sit entènèt nou an!
Ajan ki baze sou AG-Cu fil alyaj (AG72Cu28)
Itilize kòm materyèl brasaj prensipal yo se AgCu7.5,AgCu25, AgCu28, AgCu55, elatriye, ak AgCu28 a lajman itilize.Yo gen bon konduktiviti, likidite ak mouillabilite, epi li se lajman ki itilize nan endistri a vakyòm elektrik. Akòz rezistans ki ba nan chaj alontèm anba tanperati ki wo, li se sèlman apwopriye pou brasaj pati ki gen tanperati k ap travay pi ba pase 400ºC.
Itilize kòm pyès monnen ak dekorasyon. Alyaj yo itilize kòm pyès monnen yo se AgCu7.5, AgCu8,AgCu10, elatriye; alyaj yo itilize kòm dekorasyon yo se AgCu8.4, AgCu12.5, elatriye
Konpozisyon nòmal%
| Ag | Cu | Sn | Ni | Pb | Fe | Sb | Bi | |
| AgCu4 | 96+/-0.3 | 4+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
| AgCu5 | 95+/-0.3 | 5+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
| AgCu7.5 | 92.5+/-0.3 | 7.5+0.3/-0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
| AgCu8.4 | 91.6+/-0.3 | 8.4 +/-0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
| AgCu10 | 90+/-0.3 | 10+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu12.5 | 87.5+/-0.3 | 12.5+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu20 | 80+/-0.3 | 20+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu23 | 77+/-0.5 | 23+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu25 | 75+/-0.5 | 25+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu26 | 74+/-0.5 | 26+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu28 | 72+/-0.5 | 28+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
| AgCu50 | 50+/-0.5 | 50+/-0.5 | ≤0.005 | ≤0.25 | ≤0.002 | ≤0.002 | ||
| AgCu99 | 1+/-0.2 | 99+0.2/-0.5 | ||||||
| AgCu18Ni2 | 80+/-0.5 | 18+/-0.5 | / | 2+/-0.3 |
Ekri mesaj ou la a epi voye l ba nou
